Upcoming Events


Advanced Processes Innovation Day

When:

August 08, 2013

Where:

Akron , Ohio - United States

Venue:

Polymer Engineering Academic Center, Aggarwal Lecture Hall

250 South Forge Street, Akron, OH 44325-0301

Event Website:

Click here to visit event site

Event Registration Page:

Click here to visit registration site

Cost:

0

Registration Deadline:

20130808

Sponsor/Organiser:

University of Akron, RJG,Trexel, and Moldex3D

Attendence Limit:

None

Event Format:

Technical seminar

Sponsorship opportunities:

No

Event Frequency:

Unscheduled

Contact Information:

Rob Stipek

robstipek@moldex3d.com

12489464570

Event Detail:

CoreTech System (Moldex3D), in collaboration with The University of Akron, RJG and Trexel, is organizing a one-day seminar on August 8th focused on the technologies and innovations that are changing the face of manufacturing. Each year, the Molding Innovation Day series offers product designers/ engineers, industry leaders and decision makers an opportunity to explore multiple advanced manufacturing processes in depth to help them develop a better understanding of recent developments and provide versatile solutions to match their specific business needs. Attendees will benefit from experiencing the vast array of technologies available, including MuCell®, Injection-Compression Process, Cavity Pressure Technology and 3D CAE Injection Molding Simulation Technology.


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