Automotive Surfaces Conference 2013

When:

November 26-27, 2013

Where:

Berlin Germany

Venue:

Concorde Hotel

Augsburger Strasse 41

Markets:
Event Website:

Click here to visit event site

Event Registration Page:

Click here to visit registration site

Cost:

BEFORE September 30, 2013: €750 + German VAT/ AFTER September 30, 2013: €1000 + German VAT

Registration Deadline:

Not provided

Sponsor/Organiser:

European Plastics News

Attendence Limit:

Not provided

Event Format:

Conference

Sponsorship opportunities:

Yes

Details on Sponsorship Opportunities:

http://www.decorativeautomotiveplastics.com/automotivesurfaces2013/sponsors

Event Frequency:

Not provided

Contact Information:

Ketty Rofallet

krofallet@crain.com

+44 208 253 9621

+44 7920 163 164

Event Detail:

The interaction between man and machine has become increasingly important in the age of the smartphone, and demands for car surfaces' look, feel and usability continues to be a priority in car manufacture.

A variety of dedicated processes and technologies have been developed over the years to produce desired surface properties and create added value for the user. Well-established are multi-component injection moulding, in-mould labelling and in-mould decoration with films and fabrics.

However, new approaches are also appearing, not just to create decoration, but to integrate functionality into surfaces using the in-mould decoration process. Circuitry and electronics are being embedded, whereby direct interaction with a sensitive surface allows drivers to use gentle touches and waving to control consoles. At the same time, new methods of creating protective elements of interior surfaces are coming on the market introducing scratch resistance, self-healing elements and water repellence to make finishes robust to potential damage.

The conference will attract and connect OEMs, Tier 1 manufacturers and plastics companies, and examine exciting developments in the sector as the boundaries between drivers, vehicles, and smartphones begin to dissolve.


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