Upcoming Events


Beijing International Packaging Fair- CHIPF2014

When:

June 30, 2014 - July 02, 2014

Where:

Beijing China

Venue:

New China International Exhibition Centre

Markets:
Event Website:

Click here to visit event site

Event Registration Page:

Click here to visit registration site

Cost:

0

Registration Deadline:

April 30, 2014

Sponsor/Organiser:

China Packaging Federation

Attendence Limit:

None

Event Format:

Trade Show & conference

Sponsorship opportunities:

No

Event Frequency:

Every other year

Contact Information:

Jason Cey

xingjiaup@qq.com

861051026890

861051026893

Event Detail:

CHIPF2014 Gathers Leading Technologies and Products among World Packaging Industries, Achieve Brilliant Again


Much-anticipated CHIPF2014 will be grandly held from June 30 to July 2,2014 in New China International Exhibition Centre (NCIEC). Itís anticipated to have 500 exhibitors and over 50,000 professional visitors attending the exhibition. Itís become one of Asian largest comprehensive packaging exhibitions, meanwhile, itís the sole packaging exhibition majorly supported by the Ministry of Commerce of the Peopleís Republic of China. CHIPF2014 will be again presented on a lager scale, a strong international lineup and more professional buyers.

With fast growth and stable development of China's economy, packaging has become widely applied to printing, food, beverage, dairy, pharmaceutical, daily chemical, electronics, logistics and other industries,and itís closely related to people's lives. CHIPF2014 will take ďpackaging changes lifeĒ as the theme, ďachieve sustainable development of packaging industryĒ as the goal as well as all-round displays the latest technologies, products and solutions in various packaging fields at home and abroad,setting up an efficient interactive platform for supply and demand sides.


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