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Improved mold releases for epoxies

January 30, 2013

Axel Plastics Research Laboratories Inc. announces two internal mold release additives for dicyanamide-cured epoxy resin.

The Woodside, N.Y., firm claims DICY-cured epoxies are among the most tenacious in bonding properties and have prompted a search for better release in resins, compounds, prepregs and laminates. Many conventional mold releases hurt the cure of the DICY resin, leaving the polymer under-cured and tacky, Axel claims.

MoldWiz INT-1322 does not affect cure of imidazole- or amine-accelerated DICY. MoldWiz INT-1329 is formulated for higher process temperatures for non-accelerated DICY-cured epoxy resin.

Axel claims the new releases have good pot life in resin mixes and provide good release from molds and substrates. The products are proprietary blends of organic fatty amine and acid derivatives with surface active agents. Addition levels of 0.5 to 4 percent are effective, depending on the process and fillers.

Tel. 800-332-2935 or 718-672-8300 ext. 16, fax 718-565-7447, email nteufel@axelplastics.com.