Saint-Gobain Ceramic Materials is offering an unusual filler that promotes thermal conductivity and inhibits electrical conductivity in thermoplastics.
The firm, with a North American office in Amherst, N.Y., says it has developed CarboTherm, a new generation of boron nitride for thermoplastic polymers. Saint-Gobain claims the additive offers low density and low coefficient of friction compared with conventional, competing materials such as aluminum nitride, silicon nitride, silicon carbide, aluminum oxide and zinc oxide.
The company is aiming the new filler at applications such as custom-molded heat sinks on circuit boards, appliance heat exchanger tubing, telecommunication components, and automotive under-the-hood components.
Saint-Gobain says CarboTherm compounds can replace metal heat sinks, saving weight and allowing design freedom through moldability.
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