March 13, 2013
Mitsubishi Plastics Inc. has developed pitch-based carbon fiber reinforcement that costs almost half as much as conventionally made pitch-based carbon fiber.
Dialead K13C6U is an ultra-high modulus grade that provides high heat conductivity and rigidity. The Tokyo firm said the cost reduction derives from tripling the number of filaments per carbon fiber bundle to 6,000.
The lower cost promises to expand the range of applications for pitch-based fibers beyond electronics devices for artificial satellites. Wider use in electronics parts in avionics and in heat sinks, light-emitting diodes and vehicles are more feasible, claims Mitsubishi.
Pitch-based carbon fibers allow production of plastic composites with nearly zero coefficient of thermal expansion. Their high cost compared with polyacrylonitrile-based carbon fibers has been a drawback for wider usage. Dialead K13C2U has almost triple the thermal conductivity of aluminum, a desirable feature for heat-dissipation applications, the company explains.
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