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Teijin claims resin improves in-mold decorating

By: Michael Lauzon

July 3, 2013

Teijin Ltd. of Tokyo says it has a new polycarbonate for in-mold decorating that allows higher productivity and lighter mobile devices.

Teijin claims the new resin provides an efficient way of decorating plastic parts during injection molding. The technique also promotes lighter-weight parts. Applications can include smartphones, tablets, medical devices and auto parts.

The Japanese firm claims the use of special glass fibers and additives gives the PC high rigidity and dimensional stability for thin-wall molded cases. Teijin also boasts the resin gives high flatness and 40 percent greater fluidity than conventional glass-filled PC materials. The new material provides a high degree of flame retardance.

Teijin says competing materials such as carbon-fiber-reinforced resins and magnesium alloys demand additional processing after molding. Conventional PC and nylon composites used for casings in mass-market devices are susceptible to wrinkles, cracks or other degradation during in-mold decorating, the firm claims.

Tel. 81-33506-4055, email pr@teijin.com.jp.