TOKYO - Mitsubishi Gas Chemi-cal has licensed Nelco Inter-national Corp. of Anaheim, Calif., to produce laminates for the worldwide semiconductor industry using MGC's proprietary technology. The materials are designed for use with plastic semiconductor packages in high-density applications.
The materials are produced by MGC at two factories in Japan, where production will continue to supply customers worldwide.
The licensing agreement, by expanding the production base to two companies in two countries, will benefit customers by stabilizing the supply. NIC's initial production plans are to manufacture the materials at its factory in Tempe, Ariz.
According to an MGC marketing manager in Tokyo, the technology-transfer license covers copper-clad laminate for printed circuit boards for high-reliability, high-density semiconductor plastic package applications. Tokyo-based MGC said the laminate resulted from five years of development and has been subjected to extensive field testing in customer applications.
MGC is a leading supplier of such laminates to the electronics industry, but the semiconductor manufacturers who are introducing this kind of high-density plastic packaging are concerned about supply stability.
If a single firm were the dominant source of supply, concerns about possible shortages would cause many to shy away from the material.
Two years ago, an explosion knocked out a Japanese resin plant that was the sole source of a critical material to semiconductor manufacturers.
The result was an industrywide panic that sent device prices upward until new sources were developed. That experience is still fresh in the minds of executives at major semiconductor firms. By licensing Nelco, MGC hopes to promote the use of this type of package and expand the number of total applications for the laminate.