ANAHEIM, CALIF. — A deep-pockets, high-technology joint venture is ramping up production of a wafer-level, chip-scale packaging technology that makes major use of a Dow Chemical Co. thermoset polymeric dielectric material.
Flip Chip Technologies LLC of Phoenix said the new Ultra CSP costs about one-half of current CSP options on the basis on price per electrical connection. The technology works in a cellular telephone, hand-held or laptop computer hard-disk drive with less than 100 electrical connections for flash memory, a microcontroller or dynamic random access memory, known as DRAM.
Ultra CSP was developed to fill a gap between ball grid arrays and direct chip attachments.
The firm has the capacity to make about 200,000 Ultra CSPs per week, and expects to raise that figure to 1 million packages per week in June.
A redistribution layer of an aluminum-nickel/vanadium-copper structure separates two benzocyclobutane layers, and a standard semiconductor spin-on process is used to apply benzocyclobutane to the wafer, said Peter Elenius, Flip Chip vice president of technology development. He spoke in an interview at Nepcon West '98, held March 1-5 in Anaheim.
Flip Chip Technologies was formed in 1996, employs 80 and occupies a 35,000-square-foot facility that includes a 13,000-square-foot Class 1,000 clean room. The automated fabrication operations serve about 75 customers now.
Kulicke & Soffa Industries Inc. of Willow Grove, Pa., a supplier of semiconductor assembly equipment, owns 51 percent of the venture, and General Motors Corp.'s Delphi Delco Electronics Division of Kokomo, Ind., owns 49 percent. The partners have invested more than $40 million in two years, officials said.