ANAHEIM, CALIF. — A time-saving epoxy and fluxing agent won the electronics assembly, chemicals and materials category in the electronic industry's annual awards program at Nepcon West '98 in Anaheim.
In extending its line, Kester Solder Co. of Des Plaines, Ill., developed the polymer reflow encapsulant Se-Cure 9101.
Using the material, a manufacturer can eliminate two or three traditional steps in assembling high-end microelectronic components on printed circuit substrates, said Brian Deram, market development manager.
The primary cure takes less than seven minutes. A secondary cure requires 30 minutes to cross-link the epoxy.
Kester is a division of Woodland Hills, Calif.-based Litton Systems Inc.
In a March 3 ceremony, Electronic Packaging & Production magazine and Nepcon trade officials announced awards in six categories for equipment and material developments.