Plastics News correspondent Roger Renstrom reported these items from the wafer processing portion of the Semicon West '98 trade show, held July 13-15 in San Francisco.
DuPont Dow venture has new Kalrez grade
Joint venture DuPont Dow Elastomers LLC introduced a low-compression-set compound for use in semiconductor dry process applications.
Parts of Kalrez Sahara 8375, a perfluoroelastomer, have low-particle generation, good plasma resistance and stability at temperatures as high as 572° F, Ronald Smith, the firm's Americas sales manager in Newark, Del., said at the show.
Parts such as O-rings and custom shapes can survive in a variety of aggressive dry wafer processes, according to the Wilmington, Del., company.
Separately, DuPont Co.'s photopolymer and electronic materials unit in Research Triangle Park, N.C., showed its proprietary Tacky Dots film system. The system can transfer preformed solder spheres to fine-pitch semiconductor wafers and electronics substrates. The technology can compete with solder plating or screen printing.
A special adhesive forms a pattern of tacky areas that are covered with conductive particles and transferred to integrated circuits or packages. DuPont and a Texas Instruments Inc. semiconductor unit have completed development work, and DuPont is distributing samples to the semiconductor packaging industry from a DuPont pilot line, Brian Quinn, a DuPont new business initiative manger, said.
Patterns of Tacky Dots match the number and position of pads on an electronic device. The system uses a tacky photopolymer, a thermally stable support film, such as Kapton polyimide, and ultraviolet exposure.
Also, DuPont Tribon Composites Inc. of Valley View, Ohio, has added two new forms of Zymaxx chemical- and creep-resistant parts. One addition offers a random type of orientation, and the other uses fibers other than carbon, David Pfaff, manager of applications engineers, said. These forms offer chemical resistance for carrier rings, polishing gears and retaining wear rings and will compete with acetal and polyphenylene sulfide.
Dense-film polymer in pilot production
Air Products and Chemicals Inc. subsidiary Schumacher is beginning pilot production of its dense-film Velox high-temperature polymer for interlayer dielectric applications in the semiconductor industry.
Velox is a polymer with an arylene ether repeat unit, said Raymond Vrtis, principal research scientist with Schumacher in Carlsbad, Calif. The material has a low dielectric constant that permits high device speed and low power consumption.
Air Products' corporate science technology center in Allentown, Pa., handled development of the product. Initially, Air Products will perform production. Schumacher is applying its experience in microelectronics to develop new materials including porous oxide and organic products.