ANAHEIM, CALIF. — Meiho Co. Ltd. has entered the machine market.
Meiho demonstrated a new all-electric-drive, 33-ton, low-pressure injection molding machine for the semiconductor industry at the Nepcon West exhibit, held Feb. 23-25 in Anaheim. Until now, Fukuoka, Japan-based Meiho has been mostly a custom injection molder and mold maker.
The system is the first to use thermoplastics for packaging semiconductors, said Akira Nagamatsu, president and chief executive officer. He spends time each year at the Meiho Technology Inc. unit, which was established in Anaheim in 1996.
Using standard thermoset material for packaging semiconductors may require a processing time of three minutes. The thermoplastic process using polyphenylene sulfide is completed in about 30 seconds, reducing production costs.
The system has a sealed housing to meet cleanliness requirements for manufacturing semiconductors.
Over 15 years, Meiho researchers developed the system in cooperation with the R&D department of Toshiba Corp.
Meiho is developing a 60-ton model and eventually plans to have an 80-ton version. A Meiho division manufactures integrated-circuit-chip systems using thermoset material and is experimenting with ways to use thermoplastics to package ICs.
Meiho operates 35 injection molding presses at a Fukuoka plant and 16 machines in Anaheim. All are Nissei units with clamping forces of 5-240 tons. Separate divisions make molds for stretch blow molding and injection molding.
Meiho employs 25 and had 1998 sales of $2.3 million in the United States. The Japan operations employ 300 and had sales of $40 million.