RTP Co. debuted thermoplastic electronic component encapsulation compounds to compete with thermoset materials.
The compounds protect sensitive components from moisture and other environmental conditions and improve thermal conductivity by dissipating heat. RTP claimed they have a lower coefficient of thermal expansion than thermoset materials for improved thermal cycling performance.
The Winona, Minn., company envisions their use in encapsulating resistors, integrated circuits, capacitors and fiber-optic connectors.
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