CHICAGO (Aug. 7, 4:40 p.m. EDT) — Stapla Ultrasonics Corp. of Wilmington, Mass., showed at NPE in Chicago a newly patented process for bonding thermoplastic films with thicknesses of less than 0.006 inch. The process can create an ultrasonic seam weld between two thin layers of film.
The company adopted the process from one that it launched in 1997 for bonding metal films or foils, said Timothy Crider, Midwest operations manager.
In welding trials, Stapla successfully bonded thermoplastic films as thin as 0.001 inch.
With ultrasonic seam welding, Stapla aims to supplant thin thermoplastic film processes such as splicing rolls of material to feed a continuous manufacturing line and forming thermoplastic tubes from thin film flat stock.