NEC Corp. has married carbon-fiber reinforcement with the bioplastic polylactic acid to create composite boards with higher heat conductivity than stainless steel.
The Tokyo telecommunications major said the new composite board could be suitable to a range of electronic devices. The board has good heat conductivity only in the board's plane direction, which is difficult to get with a metal board.
NEC said the board's heat-dissipation property could lead to its use in housings. Metal housings have the drawback of also dissipating heat through the housing thickness, possibly leading to localized overheating.
NEC touts the board's high biomass-derived content — more than 90 percent when the carbon-fiber mass is subtracted — as environmentally friendly.
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