EDI displaying feed block, coating die
CHIPPEWA FALLS, WIS. Flat-die maker Extrusion Dies Industries LLC will feature two new products at K 2010 in Dusseldorf, Germany: a new feed block for flat-die coextrusion, and a new-generation extrusion-coating die.
The Chippewa Falls-based company developed the feed block to simplify the procedure for fine-tuning layer thicknesses.
A feed block combines melt streams from separate extruders into a multilayer sandwich, which the die then distributes to target product width. The new Ultraflow V feed block has adjustable combining planes located where the melt streams join the central flow channel.
The planes can operate in two modes, each with a different advantage in terms of ease and adjustability. By leaving the plane in free-floating mode, operators can let the position be determined directly by the equilibrium pressure developed by flow from the extruders.
But for polymers whose interaction at the point of confluence poses the possibility of disrupting or compromising the multilayer structure, the adjustable plane can be moved manually to fine-tune polymer flow.
Our standard Ultraflow feed block ... enables processors to fine-tune layer thicknesses by interchanging specially machined flow inserts, without having to disassemble the feed block, said EDI President John A. Ulcej in a news release. The new Ultraflow V feed block eliminates even this step by using built-in combining planes. It is, in addition, a compact device, easy to disassemble and clean, and streamlined for optimal flow.
EDI's new extrusion coating die is designed to simplify changes in product width and eliminate much of the deckle disassembly involved in cleaning and maintenance.
The company's EPC die incorporates a deckle system that can be adjusted to minimize the formation of edge bead. The new product at K 2010 will feature an enhanced system that increases the ease and repeatability of width adjustments.
SPI using K to tout NPE's new location
WASHINGTON The world's largest plastics technical conference will collocate with the Western Hemisphere's largest plastics industry trade show when the retooled NPE takes place in Orlando, Fla., from April 1-5, 2012.
The Society of the Plastics Industry Inc. said the Society of Plastics Engineers has agreed to again stage its Antec annual technical conference alongside the SPI-owned NPE 2012 show. The two groups first collocated their events at the last NPE show, held in 2009 in Chicago. Antec 2010 attracted some 630 presentations and attendees from 40 countries.
SPI is using the huge K 2010 show in Dusseldorf, Germany, to roll out a new NPE marketing campaign, called Breaking the Mold, and to tout the cost savings and logistical advantages of the show's new venue, Orlando's Orange County Convention Center. After staging every NPE since 1971 at Chicago's McCormick Place, SPI decided to go south for at least the next two triennial NPEs.
The move will save the plastics industry $20 million in expenses, while offering increased user friendliness to exhibitors and attendees, according to SPI CEO William Carteaux. As a result, he said, many companies are planning to have larger exhibits and more operating machinery on the show floor, compared with the last NPE.