Bemis Co. Inc. is teaming up with Thin Film Electronics ASA to develop “intelligent” packaging for perishable products.
The firms have signed an agreement to accelerate commercial development of functional sensor labels made from Thin Film's printed electronic technology. The line of labels will monitor, collect and wirelessly communicate the packaged products' key physical and environmental data.
Thin Film said it had formed other technology partnerships to develop an inexpensive, integrated, time/temperature sensor for perishables and pharmaceuticals. The company said its partnership with Bemis will extend that work to create a sensor that can be tailored to individual customer requirements.
The Bemis Intelligent Packaging Platform should be commercially available by 2014.
“Intelligent packaging is an emerging technology with many potential intersections with Bemis' flexible packaging and pressure-sensitive materials business segments,” said Bemis President and CEO Henry Theisen in a news release. “Our agreement with Thin Film Electronics ASA is an investment in technology that could eventually make printed electronics a component of every package we manufacture.”
Thin Film, based in Oslo, Norway, said it was the first company to commercialize printed rewritable memory, and is focused on developing printed products with memory, sensing and wireless communication technology.
Neenah, Wis.-based Bemis is North America's largest film and sheet manufacturer, with $5.3 billion in sales in 2011.