Mitsubishi Engineering-Plastics Corp. has developed two high-dielectric resin systems that allow downsizing of mobile terminal antenna in wireless communications devices.
The Tokyo firm said it has formulated two systems that are well suited as the base material for miniaturized antenna. One is based on polycarbonate, the other has modified polyphenylene ether as the base material. Each is applicable to specific applications and manufacturing processes.
The materials have little dielectric anisotropy and a loss of 0.01 or less dissipation factor, claims Mitsubishi.
Mobile gadgets such as smartphones and tablets have become multifunctional and smaller, making the space reserved for antenna smaller. Conventional resins have relative permittivity of about 3 but the new, improved systems have permittivity of about 8.
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