Comexi Group Industries SA, a Spanish packaging company, will host a special packaging conference to mark the opening of its first U.S. tech center — and its third technology center globally.
The Jan. 25 event at the Comexi Manel Xifra i Boada Technology Center in Miami with focus on "Envisioning the Future of the Flexible Packaging Industry."
Comexi first announced plans for the U.S. tech center in 2020.
Attendees will be able to explore recent market trends, view live demos of flexo and laminating and tour Comexi's facilities.
Alison Keane, president of the Flexible Packaging Association, and Clemson University's Chip Tonkin will speak at the event.
Comexi already has production in Spain and Brazil with the Miami site being the first U.S. facility. The focus there is on innovation and trends in flexible packaging for the North American market.
The new facility is 15,000 square feet with a dedicated area for demonstrations and industrial testing. There will also be training programs covering prepress, flexo, lamination and rewinding. The company says it wants to provide a seamless experience and have convenient access to service and spare parts.